Used DAITRON DBM-412NR #9410953 for sale

DAITRON DBM-412NR Wafer Grinding, Lapping & Polishing Equipment is a high accuracy, automated system that is designed for large to small wafers in metal and glass substrates. The unit is capable of high precision lapping and polishing operations. The mechanical process takes advantage of the nature of metal and glass substrates to produce a very flat and low-edge-roughness surface finish. The machine has a powerful grinding head which works with variable speed rotation upto 4000rpm, enabling a high level of accuracy for wafer grinding. It has an innovative design for easy loading, positioning, and clamping which increases productivity and lowers scrap rate. The tool also has a lapping function which uses either diamond or silicon carbide grinding belts. The high speed lapping process is used to create a very flat surface with a low-edge-roughness. It also has a special polishing station which uses the same lapping process but with a polishing belt which produces a high-gloss finish. The asset also has an advanced cooling model which quickly cools the wafers after the grinding and polishing processes, so that the thermal effects on the wafers are minimized. Additionally, the equipment has sensors to detect the temperature and pressure, so that the grinding and polishing processes are kept under control. DBM-412NR system also has a user-friendly graphical touch panel which makes it easier to operate the unit. This machine is ideal for metal- and glass-based substrates and offers high accuracy, reliability, and productivity for wafer grinding, lapping and polishing applications.