Used DAITRON DBM-412R #9379116 for sale

DAITRON DBM-412R Wafer Grinding, Lapping & Polishing Equipment is a powerful and precise machine ideal for single-side work with wafers of various sizes. It is a highly-regarded system among semiconductor manufacturers, and is known for its high accuracy for precise processing and its ability to precisely grind, lap and polish both single and double-side wafers. It features a highly-rigid unit that makes it effective for processing challenging materials. The machine is capable of grinding, lapping and polishing wafers of up to 70 mm in diameter. It can be used to process single-sided and double-sided wafers of various sizes. The tool has an indexer that moves the wafer to a processing place with a chuck and then to one of four lap plates. The indexer is driven by a stepping motor at a constant speed and is able to process various kinds of wafers without adjustment. The grinding, lapping and polishing process is controlled by a microcomputer, which can adjust the speed of each lap plate and the distance between the grindstone and the lap plate. This makes it possible to finely control the machining process, thus providing excellent results. The asset features a control panel with a step speed control and a positioning model that can be operated by either manual or automatic mode. In addition, DBM-412R can be equipped with up to three grindstones, lapping disks, and ultra-sonic vibration plates. This enables the equipment to precisely carry out a full range of machining operations. The grinding stones and lapping plates can also be equipped with different grinding wheels and lapping films for different types of grinding and polishing operations. The system features a powerful cooling unit to ensure that the machine is operating at an optimal temperature for accurate results. In addition, it comes equipped with a motor-driven air jet nozzle, which is used to prevent overheating and provide secure clamps for workpieces during grinding. DAITRON DBM-412R Wafer Grinding, Lapping & Polishing Unit is a quick-acting and precise machine that provides precise results with challenging materials. Equipped with intuitive controls, adjustable speed and temperature control, and various grinding tools and wheels, this machine is an ideal choice for any semiconductor manufacturing and research facility.