Used DAITRON DBM-602R #9239639 for sale

DAITRON DBM-602R
ID: 9239639
Wafer Size: 6"
Vintage: 2011
Breaker, 6" 2011 vintage.
DAITRON DBM-602R is a fully automated wafer grinding, lapping and polishing equipment. It is designed to provide superior performance in the production of wafer-level optics and is used in a variety of semiconductor manufacturing processes. Its main features include a 3-axis CNC ultra-precision motion system with an accurately controlled rotary head, an integrated wafer chuck for manual and automated wafer mounting. The unit also has a temperature controlled process chamber that accommodates up to four cassettes. The machine is designed to grind, lap and polish wafers with a diameter of up to 8 inches. It has a maximum grinding force of 20N, a maximum lapping force of 19N and a maximum polishing force of 36N, allowing for precise control over the three processes. The tool is equipped with a DC motor servo control asset that gives it a high level of accuracy and repeatability. The model features an automated wafer transfer equipment that allows for precise alignment of each wafer in the process. It can also accurately monitor the progress of the grinding, lapping and polishing processes through its integrated process monitoring system. The unit also comes with a range of process parameters to adjust the grinding, lapping and polishing processes to suit each application. The machine is also designed with various safety features to prevent accidents or damage to the wafers. Its transparent hood allows the operator to monitor the process while simultaneously protecting the process chamber from airborne contaminants. The tool also features a number of protective shields and pads to prevent potential injury or damage. Additionally, voice alarms and warning alerts can be triggered to alert the user of any abnormal conditions or issues. DBM-602R is a reliable and advanced asset that has proven itself in multiple semiconductor manufacturing applications. Its precise, controllable and automated operation make it an ideal solution for the production of high-quality wafer-level optics.
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