Used DAITRON DBM-603 #9247683 for sale

DAITRON DBM-603 is a wafer grinding, lapping and polishing equipment for a range of substrates and wafer sizes. It features a 6-axis Robot Arm Handler equipped with a three-axis headless spindle motor for precise grinding and lapping operations. The system can be used for semiconductor wafers, device substrates, thin films and optical materials including glass, ceramics, and metals. The unit provides a simple and efficient process workflow with a user-friendly interface. DBM-603 ensures accurate grinding and finishing with its stable spindle motor and dynamic grinding pattern adjustment. This machine is capable of attaining uniform surface finish with high precision. The Robot Arm Handler is equipped with a rigid tool holder and integrated air chuck to obtain a precise three-dimensional grinding pattern. The Tool Path Editor is capable of setting the variables of grinding step and speed based on the material and wafer size. The closed-loop control tool stabilizes the tool torque to reduce any model deviations of the spindle motor. This ensures that the grinding parameters are maintained on the substrates for precise grinding operation. The lapping process of DAITRON DBM-603 includes an integrated air purge asset to remove any dust and particles from the polishing surface. It also features a resistive heating model which supports quick and uniform lapping. DBM-603 is compatible with various lapping discs in different sizes and material combinations. This makes it possible to achieve the desired uniformity and surface finish in a single pass. The automatic spindle loading equipment ensures quick and error-free loading of lapping tools to the Motor Deck. The polishing system of DAITRON DBM-603 is integrated with a 5 Program Select Unit which enables easy selection of polishing parameters and steps. This machine also features a self-correcting automatic pressure mechanism which monitors the contact pressure between the polishing pad and the substrate. This ensures accurate and uniform polishing results. The tool is also equipped with a water filter to remove any dirt from the polishing surface. DBM-603 is equipped with a powerful software package to configurate the grinding, lapping and polishing process. The software features various data management tools to store and monitor the grinding and polishing parameters such as pressure, speed, feed rate, number of strokes, etc. It also provides various graphical tools to evaluate polishing results and overlay images for comparison. DAITRON DBM-603 provides reliable results with minimal setup time to reduce the production cost. This asset is also compact and requires minimal maintenance, making it an efficient tool for precision wafer grinding, lapping and polishing.