Used DAITRON DBM-802R #9351449 for sale

DAITRON DBM-802R is an advanced wafer grinding, lapping, and polishing equipment designed for precise precision engineering. The system has a compact footprint and is capable of processing extremely thin wafers of up to 0.2 mm in thickness. It can also produce high-precision products with sub-micron surface uniformity and minimal particle generation. The unit consists of an electric drive motor, two spindles, a controller, and a variety of grinding, lapping, and polishing accessories. The industrial-grade spindles are highly efficient and can provide rotational speeds of up to 4,000 rpm, allowing for fast and accurate phase progression. The controller can be programmed through a range of parameters, enabling users to optimize their performance with precision settings such as material hardness, removal rate, feed rates, and more. DBM-802R is equipped with a variety of grinding, lapping, and polishing accessories, including flat-bottomed and rounded-bottomed abrasive discs, diamond wafer grinding points and cups, diamond saws, polishing pads, and 3M abrasive jewelry polishers. The machine can be used to process a variety of materials, such as silicon, silicon carbo nitride (SiCN), glass, and quartz. The tool employs a variety of safety measures to protect its operators from accidental contact with grinding discs and other sharp objects. These measures include a safety interlock that prevents the motor from activating when the tool cover is open. A set of guards with integrated interlocks also ensures that the operation is not started before all safety guards are in place. DAITRON DBM-802R is highly reliable, and can be used in a wide range of production environments, from high-volume operations to low-volume applications. Its flexibility and robust build quality make it the ideal asset for precision engineering applications. It is suitable for a variety of industrial applications, ranging from semiconductor wafer processing to medical device manufacturing.