Used DAITRON DSC-100CV #9155936 for sale

DAITRON DSC-100CV is a state-of-the-art wafer grinding, lapping, and polishing equipment optimized for the production of ultra-flat and superfine surface finish on a wide variety of materials. It is an advanced computer-controlled system designed and engineered for efficiency and accuracy, providing the highest quality in wafer processing. The unit has three separate components: a grinding stage, a lapping stage and a polishing stage. The grinding stage utilizes a hybrid rotational spindle and linear motor to ensure a precise and repeatable surface finish. This spindle is connected to a motorized table that moves the substrate in a controlled manner. The lapping stage features a spindle and advanced segmented solvent compounds that are optimized for removing any residual surface damage from the grinding process. Finally, the polishing stage features a high-torque planetary machine. This tool uses a special diamond slurry to impart an ultra-fine finish over the entire surface of the wafer. DSC-100CV also comes with a suite of advanced software designed to maximize efficiency and accuracy in the wafer processing. This includes real-time monitoring of the grinding, lapping and polishing processes. The asset also has advanced controls that allow the operator to adjust settings for a precise and repeatable finish. The software also enables efficient data storage and reporting, allowing the operator to observe the progress on a job at any given time. The model is designed with operator safety in mind, featuring an integrated dust-collecting unit and advanced emissions monitoring. DAITRON DSC-100CV also has a compact design and is easy to setup and use, allowing it to be quickly incorporated into any production environment. With its combination of advanced technology and user-friendly design, DSC-100CV is the ideal equipment for exceptional quality wafer production.