Used DAITRON WBM-210 #293617726 for sale

DAITRON WBM-210 is a wafer grinding, lapping and polishing equipment designed for precision polishing of semiconductor wafers and flat substrates. This system is capable of producing a high-quality, uniform finish on both hard and soft materials. WBM-210 features two independent control loops, one for grinding and lapping and the other for polishing. This unit is designed to offer high flexibility, accuracy and reproducibility, while providing the user with a safe and reliable operating environment. DAITRON WBM-210 is equipped with a precision DC motor which drives a high-performance micrometer-scale spindle. This provides a high degree of accuracy and reproducibility when grinding, lapping and polishing wafers. The wafer grinding part of the machine is driven by an AC spindle motor that is capable of producing up to 20,000 rpm. This allows for a high degree of accuracy during grinding and lapping processes. WBM-210 also offers an automated, computer-controlled polishing process, with a user-adjustable polishing angle and pressure. DAITRON WBM-210 features a process monitoring machine that allows for error tracking and troubleshooting. This tool provides users with vital information about the process, such as polishing angle and pressure, as well as wafer contact, which helps to ensure the highest level of accuracy. Additionally, WBM-210 features an integrated diamond polishing disc, which allows for a consistent and uniform finish, as well as a high level of accuracy. In addition to its impressive grinding, lapping and polishing capabilities, DAITRON WBM-210 also offers a wide range of other features. One of these is its safety features, which include a solenoid safety switch, as well as an automatic shut-off asset that prevents overprocessing. WBM-210 also has a vacuum cleaner, cooling fan and dust collector, which helps to ensure a clean and environmentally-friendly work environment. Overall, DAITRON WBM-210 is a reliable and powerful wafer grinding, lapping and polishing model that is designed to provide users with a high degree of accuracy and reproducibility. This equipment offers a broad range of features, making it ideal for a variety of grinding, lapping and polishing applications. Whether you're looking for a precision finish for small wafers or for a large batch of flat substrates, WBM-210 is an ideal choice.