Used DAITRON WBM-210 #9148050 for sale

DAITRON WBM-210 is an advanced wafer grinding, lapping and polishing equipment designed for the production of advanced semiconductor devices. It is designed to not only provide a high material removal rate but also to provide the highest level of surface quality and efficiency. WBM-210 utilizes a swing arm system containing two grinding and lapping heads with integrated high precision spindle motors, each able to generate two, independently controlled, multi-directional grinding/lapping axes. This cutting path is able to maintain its accuracy even at very fine grinding and lapping angles. The use of high precision, heavy-duty ball bearings also enables a low vibration cutting operation. In addition, DAITRON WBM-210 has a powerful DC motor which controls the spindle speed and the angle of the grinding arms in a programmable way. It also includes a pneumatic control unit providing a uniform control of pressure applied by the grinding arm to the wafer surface. This ensures a constant removal rate while preventing wafer chips from sticking to grinding surfaces. WBM-210 can be equipped with a wide range of grinding, lapping and polishing media, such as silicon carbide, cerium or aluminum oxide and can accommodate wafers up to 200 mm in diameter. The machine also features a sophisticated control software which can adjust the grinding speed, feed rate, polishing pressure and other parameters. DAITRON WBM-210 is designed for use in cleanroom environments and features a FM-2001 filter tool for filtering the air setting up the wafer. This asset is designed to remove 99.99% of particles at 0.3 micron and also to monitor the cleanliness of the environment. Furthermore, the entire model is enclosed in a stainless steel housing which ensures that the cutting operation is conducted in a safe and reliable manner. WBM-210 is capable of providing superb surface quality and a consistent removal rate and is the perfect partner for any semiconductor production facility. It can be used for a variety of applications including, wafer backside thinning, wafer planarization, grinding, lapping, wafer dicing and polishing. With a level of integration and quality never before seen, DAITRON WBM-210 is your ideal solution for advanced wafer grinding, lapping and polishing.