Used DAITRON WBM-210 #9227963 for sale

DAITRON WBM-210 is a multifunctional wafer grinding, lapping and polishing machine that is highly versatile in its applications and efficient in its results. By specializing in grinding, lapping and polishing, WBM-210 offers a precise and reliable solution to production needs. When used in grinding applications, DAITRON WBM-210 has the capacity to grind 200mm wafers with a thickness range from 10 μm to 200 μm. This grinder is equipped with a powerful motor that is capable of producing up to 600 m/min of cutting surface which ensures increased accuracy. The grinding chuck is also driven with high precision spindles which guarantees superior grinding stability. When used in lapping applications, WBM-210 has the capacity to lap 200mm wafers with a thickness range from 10 μm to 200 μm evenly and uniformly. It is also equipped with top-of-the-line lapping pads that generate high surface quality. DAITRON WBM-210 is specifically designed to produce superior flatness in lapping applications, meaning it can effectively produce high-quality, planar surfaces with minimum finesse. Finally, when used in polishing applications, WBM-210 has the capacity to polish 200mm wafers with a thickness range from 10 μm to 200 μm. This polisher is equipped with a range of specialized polishing heads designed to work with both diamond and boron carbide polishing pads. These polishing heads are highly efficient and highly reliable, allowing for fast, consistent, accurate polishing results. To ensure accuracy in all of its applications, DAITRON WBM-210 is controlled and operated through a touch-panel LED monitor which allows for precise adjustments to its functions. In addition, this machine also features a range of safety features such as a lid interlock system which prevents the lid from opening during operation, protecting staff and operators from any potential hazards. In summary, WBM-210 is a highly versatile and efficient wafer grinding, lapping and polishing machine. Ideal for grinding, lapping and polishing multi-layer wafers, this device offers great precise and reliable results. Equipped with safety features and a touch-panel LED monitor for precise adjustments, it is the perfect solution to all production needs.