Used DAITRON WBM-210 #9300589 for sale

DAITRON WBM-210 is a technologically advanced wafer grinding, lapping and polishing equipment. It is designed for the semiconductor industry, and produces intricate, tight-tolerance flat surfaces to micron level accuracies. The superior performance of WBM-210 provides the production of thin-film microelectronics, highly accurate flat surface profiles and advanced optical coatings. DAITRON WBM-210 is based upon a unique planetary grinding system that uses grinding wheels which move around in a circular pattern. This makes precision grinding much easier to achieve. The unit is equipped with a single stage, high-speed, precision spindle motor that is capable of speeds up to 6,000 rpm. This motor includes a high-torque low-maintenance direct drive spindle assembly which provides exceptional accuracy, speed and power that allows grinding at the highest levels. WBM-210 also has two grinding plate modifications. The machine has grinding plates, which have a precision ground elliptical surface, and flat plates, which can be used for lapping and light grinding. The efficiency of the grinding and polishing process is maximized through the use of the advanced diamond-abrasive materials and thin-film discs. The grinding and polishing discs are precisely matched to the application, which allows for optimal performance. DAITRON WBM-210 has a powerful water-cooled spindle motor that allows for reduced thermal expansion in the tool material, maintaining accuracy and eliminating chip build up. The tool also includes a patented material removal process control which reduces grinding errors at the start of the process and during the grinding cycle. This allows for higher yields, tighter tolerances and shorter cycle times. In addition to grinding and polishing applications, WBM-210 can be used for dry-polishing applications. The asset includes a special holder head which has two flat plates, one on the top and one on the bottom for easy access to both parties. The flat plate on top can be used to achieve an even and controllable surface finish. In all, DAITRON WBM-210 is an incredibly advanced wafer grinding, lapping and polishing model. Its combination of powerful spindle motor, precision grinding plates, diamond abrasive materials, and sophisticated process controls makes it an incredibly versatile equipment. Its tight tolerances and superior performance make it one of the best wafer grinding systems in the world.