Used DAITRON WBM-2100 #293769600 for sale

DAITRON WBM-2100 is an advanced wafer grinding, lapping and polishing equipment designed to produce the highest quality wafers through the use of advanced technologies and unparalleled precision control. The system utilizes two separate components to achieve its superior level of performance: a grinding wheel and diamond particles. The grinding wheel is powered by a highly efficient motor allowing for fast, accurate and repeatable grinding, lapping and polishing. The diamond particles used in the unit are designed for optimal abrasion giving superior results compared to competitors. The machine utilizes adjustable water pressure and temeprature control to effectively ensure a homogeneous wheel grit size across the entire wheel surface. WBM-2100 is capable of grinding, lapping and polishing aluminum, quartz and other substrates in a variety of diameters. It features a 4-axis wafer support stage for optimal material handling. The adjustable vacuum hold down is designed for consistent repeatability achieving uniform results for each substrate. DAITRON WBM-2100 also has a number of safety features such as a parameter lock, guard, and internal LED lights to display the grinding wheel's lifetime hours and warning messages. This ensures safety and prevents operating errors and further promotes repeatable processing results. For reliable, accurate processing, WBM-2100 is also equipped with Knoop hardness tester, an automated on-line scratch tester, and an online particle detector which allows the computer to continuously monitor the accuracy of the grinding, lapping and polishing process. DAITRON WBM-2100 is easy to install and set up, programmable, and includes a flexible, user-friendly HMI. It comes as a full tool with all necessary components including diamond grinding wheel, abrasive grinding wheel and a set of abrasive lapping plates, vacuum chuck and dust collector. By providing industry-leading technology, combined with superior precision control, WBM-2100 is a powerful tool for precision wafer processing.