Used DAITRON WBM-2200 #9362712 for sale

DAITRON WBM-2200 is an advanced wafer grinding, lapping and polishing equipment designed to provide superior grinding, lapping and polishing technologies. This system is capable of grinding, lapping and polishing in one compact unit, with enhanced accuracy, productivity, and reliability. The unit utilizes several versatile and user-friendly components, including a wafer turner/grinder device, a lapping plate, and a polishing press. The wafer turner/grinder device is useful for both the grinding and the lapping of wafers. This device offers the ability to turn, rotate, and grind wafers, as well as tilt and center them to ensure accuracy and consistency with each operation. It utilizes a robust motor and a bearing-mounted wheel assembly to provide sturdy and reliable grinding performance. The lapping plate comes equipped with diamond particle lapping pads to provide even and repeatable lapping results. The polishing press is capable of controlling the surface quality and uniformity of the wafer's surface. It is equipped with a calibrated load cell to ensure precise and consistent pressure on the wafers at all times. Other features of WBM-2200 include a low-maintenance design, an intuitive operator interface with multiple programmable parameters, and a robust coreless grinding mechanism for producing highly precise grinds. This machine is capable of grinding, lapping, and polishing wafers up to 12 inches across in size. Moreover, the wafer turner/grinder device is equipped with a built-in rotating disk drive for quick and easy removal of a wafer after lapping and polishing is complete. Overall, DAITRON WBM-2200 is an advanced and user-friendly wafer grinding, lapping and polishing tool designed to deliver superior accuracy, productivity, and reliability with each operation. With its versatile components, low-maintenance design, and intuitive programmable parameters, this asset provides users with a reliable and effective way to grind, lap, and polish wafers.