Used DAITRON WT-8000 #9286404 for sale

DAITRON WT-8000 wafer grinding, lapping and polishing equipment is a high-performance tool designed for rate-determining operations in the production of wafer-level product. Its patented form factor and vibration-free working space make it suitable for precision grinding, lapping and polishing in wafer-level applications requiring nanometer-level accuracy. The system comprises a spindle working area, taper head, dual-stage grinding and lapping mechanism, an electronically-controlled load cell, a vacuum-driven foam wheel and polishing cloths, and a dust-collection unit. The spindle working area has a height of 0-20mm adjustable to accommodate a wide range of wafer thicknesses, and is equipped with a spindle rotation speed controller that offers variable speeds between 0-800rpm. The taper-head ensures a uniform grinding action and excellent repeatability. The dual-stage grinding/lapping mechanism includes an adjustable bell-jar cover, a platen, and either a diamond or silicon carbide lapping disk. This mechanism offers perfect grinding performance and allows the user to quickly and precisely adjust the focusing gap. The electronically-controlled load cell, on the other hand, helps ensure a consistent grinding force over the entire surface area of the wafer. Aside from grinding, WT-8000 also enables polishing operations with its foam wheel and polishing cloths. The vacuum-driven foam wheel has two speeds of 1000 or 4000 rpm and is made of two-way bonded diamond segments that ensure uniform grinding and polishing action. The polishing cloths, on the other hand, are available in a variety of materials and sizes to suit different applications. Finally, DAITRON WT-8000 may also be fitted with a multi-tool dust-collection machine for collecting dust generated during the process, as well as a wafer transfer station to transport the wafers between the grinding and polishing sections with minimal contamination. All in all, WT-8000 is a reliable and easy to use wafer grinding, lapping and polishing tool that offers precise and superior results in the production of high-end wafer-level products.