Used DISKUS DDS 457R #9012078 for sale
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ID: 9012078
Vintage: 1986
Double surface grinder
Work piece diameter: 5 - 60 mm
Maximum work piece height: 1 - 25 mm
(2) Grinding heads
Arrangement: Bilateral
Grinding wheel:
Outside diameter: 457 mm
Grinding wheel speeds: 24 m/s
Grinding motor power: 2 x 15 kW
Power: 380 Volt
1986 vintage.
DISKUS DDS 457R is a wafer grinding, lapping and polishing equipment designed for precision polishing of both metal and non-metal surfaces. This system is ideal for high-end industrial applications, such as those found in semiconductor fabrication, automotive, aerospace, and medical industries. With its advanced design, DDS 457R wafer grinding, lapping and polishing unit ensures superior speed, accuracy, and repeatability. The machine's user-friendly design allows for a swift operational setup and easy data entry to curb the time needed for efficient production. The fundamental components of this tool are its compact, vibration-resistant grinding, lapping, and polishing unit (DDS 451) as well as the smart media feeder (MD 450). The DDS 451 supplies a powerful speed regulator which enables an efficient, efficient, and homogeneous grinding, lapping, and polishing process. Its easy-to-operate interface and user-friendly design allow users to switch between simple mode and advanced mode, allowing a smooth transition for any polishing process regardless of its complexity. The MD 450 Smart Media Feeder, on the other hand, enables a precise and continuous feed of media via its rotating media cassette. With a lightweight and low-noise design, the feeder eliminates the need for additional personnel for manual media exchange. Finally, DISKUS DDS 457R wafer grinding, lapping and polishing asset comes with an enclosed cooling unit and PLC control model for simultaneous temperature regulation and processing information management. The cooling equipment offers flexible solutions for cooling and dehumidifying and ensures temperature stability during grinding, lapping, and polishing processes. Overall, DDS 457R wafer grinding, lapping and polishing system is designed to offer superior performance, accuracy, and repeatability in all its component applications. Its user-friendly design ensures fast and efficient production, ultimately leading to increased production capacity. This unit is designed to provide users with advanced control and precise temperature regulation, making it more efficient than traditional lapping machines.
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