Used DISKUS DDS 457R #9205253 for sale

DISKUS DDS 457R is an ultra-modern wafer grinding, lapping, and polishing equipment that provides precision lapping while maintaining optimal surface finish. This system utilizes the latest advancements in grinding technology and is engineered specifically to produce highly accurate and consistent results in the lapping and polishing of wafer surfaces. DDS 457R utilizes a variety of platen configurations, grinding plates, polishing pads, and abrasive substrates to provide users the ability to achieve the highest level of wafer finishing. DISKUS DDS 457R is equipped with a powerful electric spindle drive motor capable of producing up to 1400 RPM, enabling high-level production and superior accuracy. The unit also features adjustable grinding pressure so that light, uniform polishing and a finer surface finish can be achieved. Furthermore, the machine utilizes a Manual Indexing Control, allowing operators to select the optimal run cycle, lapping speed, and quality level settings for each wafer and job. In terms of cutting efficiency, DDS 457R utilizes precise, diamond-infused cutting plates to provide fast and consistent lapping while maintaining consistent wafer thickness tolerances. This tool also features a revolutionary Silicon Slurry Manager pumpsystem for superior process control, which allows users toprogram and monitor slurry flow efficiently. Additionally, the machine is equipped withan effective oil mist filtration asset, providing cleanliness to the grinding plate surface and ensuring optimal grinding results. Overall, DISKUS DDS 457R model provides a comprehensive lapping and polishing solution, offering superior precision and accuracy for the most demanding applications. With its adjustable grinding pressure, manual indexing control, diamond-infused plates, and Silicon Slurry Manager pump equipment, DDS 457R enables an efficient, consistent, and precise wafer finishing process without compromising on quality or surface finish.