Used DISKUS DDS 457XR #9410230 for sale

DISKUS DDS 457XR is a precision wafer grinding, lapping and polishing equipment designed for maximum productivity. It is a two-axis system can be configured to accommodate up to 10 wafers in a single operation. The unit uses two positive belt-driven abrasive belts to produce a smooth, low-stress polished surface to the wafer. The two belts are driven by a powerful, variable torque spindle motor. The spindle motor controls the speed, acceleration and deceleration of the abrasive belts to ensure a consistent abrasive-to-wafer surface profile. The machine also includes a precision feedback tool to ensure consistent grinding speed, resulting in a uniform polishing surface. DDS 457XR is able to adjust the pressure applied to the wafer to control the wafer material's temperature. This allows for a fine-grained and widely consistent polishing process. The asset is also equipped with a high-quality air filter to keep the abrasive particles out of the environment. Additionally, the model includes a special coolant equipment to maintain the appropriate temperature during the grinding, lapping and polishing process. DISKUS DDS 457XR is designed for rapid, efficient and high-precision polishing. Its two abrasive belts move in a continuous cycle enabling high productivity. The system is also designed to be service friendly. It features an intuitive graphical user interface and a range of programmable settings for optimal control. The unit can be integrated with other devices such as robotic loading and unloading systems to increase the efficiency of the grinding, lapping, and polishing process. DDS 457XR is capable of producing perfectly even thickness, low-stress polished surfaces. With its two-axis precision and adjustable pressure, the machine is able to achieve submicron finishes on metal and non-metal wafers, making it ideal for use in the semiconductor and optics industries.