Used ENM G27-55AGC #170195 for sale

ENM G27-55AGC is an industrial wafer grinding, lapping and polishing equipment designed for substrates from 1mm (40 mil) to 0.5 mm (20 mil). It features a high-efficiency mechanical design that is cost-effective and reliable. This grinding and polishing system is ideal for applications that require fine surface finishes, ultra-precision surface condition monitoring, and exacting surface uniformity. G27-55AGC includes a unique grinding wheel configuration that utilises a diamond wheel and an auxiliary wheel to provide a high degree of accuracy and repeatability. The diamond wheel is designed for precision grinding and lapping and provides a fast, effective and efficient grinding process. This precision grind also allows for exact control of surface finish, uniformity and accuracy. The auxiliary wheel is adjustable to match the diamond wheel size. This enables the unit to create high precision surface profiles to a resolution of 0.2 μm. ENM G27-55AGC also includes a proprietary hydrostatic air-bearing machine that ensures chip evacuation and containment of the particles generated during the grinding and lapping processes. This tool improves the quality of the wafer and eliminates chips and other detritus from being retained on the wafer surface, which increases both accuracy and uniformity. The air-bearing asset also eliminates the need for non-biodegradable coolant while improving production speeds. The model also includes a 5-axis polishing station to adjust the surface finish and uniformity of the substrate. This station has the capability to adjust the surface finish and polishing direction from 0-30 degrees with an angular accuracy of 0.02 degrees. The polishing station can be used to profile polished wafers for a variety of applications including, but not limited to, texturing, removing contaminants and surface blemishes, increasing defectivity and improving reflectivity. G27-55AGC also features an efficient design that minimizes the risk of contamination with minimal maintenance required. The machine is equipped with a variety of safety features including over-temperature protection, automatic power shut-off and a built-in dust collection equipment. This minimizes safety risks and provides a cleaner working environment. Overall, ENM G27-55AGC is an excellent cost-effective and reliable wafer grinding, lapping, and polishing system that allows for high levels of accuracy and repeatability while providing maximum surface uniformity. It is ideal for companies that require ultra-precision surface condition monitoring and exacting surface uniformity on their substrates.