Used FUJI TECHNICA 2B-7P #9143450 for sale

FUJI TECHNICA 2B-7P is a wafer grinding, lapping & polishing equipment designed for the high-volume production of electronic components. It is capable of processing up to 7,000 wafers per hour and features an 8-track air bearing spindle made from tempered steel components. The system is capable of grinding, lapping and polishing up to 16 wafers simultaneously. The unit utilizes advanced technologies such as high-precision linear motion stage technology and wafer mapping systems to ensure precise and consistent control of each wafer's surface profile. For efficient grinding, lapping & polishing, the machine features a unique combination of a three-axis programmable spindle and a two-axis servo drive. This allows for a high level of accuracy and control during the grinding, lapping & polishing processes. The spindle has an air bearing design and is manufactured using hardened steel components for greater durability and improved performance. The spindle is powered by a high-performance servo motor with a torque capacity of up to 1.2 Nm (8.6 lb-in). 2B-7P also features a patented lapping & polishing tool that is designed to deliver superior results in minimum time. This asset utilises flexible lapping & polishing plates that allow for quick and efficient processing of a variety of wafer shapes and sizes. The lapping & polishing process is capable of efficiently achieving a flat wafer surface and can achieve excellent surface roughness in a single pass. The model includes an integrated monitoring equipment with a real-time display to allow users to monitor the process status and adjust necessary parameters as needed. The system can also be connected to other monitoring systems for remote monitoring and operation in order to maximize process accuracy. Overall, FUJI TECHNICA 2B-7P is a powerful, efficient and reliable unit that is designed for high-volume production of electronic components. It features a range of innovative technologies & features for precise control of each wafer. The machine delivers top-notch results with minimal effort and is an ideal solution for production of semiconductor and other electronic components.