Used FUJI TECHNICA 3B-8P #9143451 for sale

FUJI TECHNICA 3B-8P is a state-of-the-art wafer grinding, lapping and polishing equipment. The system utilizes precision CNC grinding technology to shape, grind, polish, and chamfer the edges of round wafers. This unit is suitable for the processing of quartz glass, sapphire, silicon, SOI, glass, GaAs and quartz composed substrates. The machine can process a maximum diameter of 8.0 inches and a maximum thickness of 4.0 mm. The tool contains a spindle with high-precision linear guides to ensure maximum accuracy and smoothness of operation. The spindle is capable of sustaining a rotational speed of up to 10000 RPM. It is also equipped with a vacuum chuck for precisely balancing the wafer during processing and to securely hold the wafer in place. The asset contains a patented floating grinding table design, which ensures gravitational loading of the wafers during grinding operation. This floating table design also eliminates the need for additional wafer support during the grinding stages. The model is capable of performing highly precise plane grinding with a roughness of 0.32 μm. This is achieved through a comprehensive array of grinding and polishing materials that are specifically designed for each application, providing a consistent and reliable finish. The equipment includes an integrated four-axis motion control system that provides users with enhanced control and flexibility. The four-axis motion control unit allows for fine adjustment of the grinding and polishing parameters including grinding angle, speed, and spindle torque. In addition, the machine is capable of automatically recognizing errors, such as chipping, and making adjustments to improve the finished product. 3B-8P is designed with a number of user-friendly features that make it suitable for a variety of applications. The tool includes intelligent programming and user-friendly operation that allow users to easily program and adjust the settings for their specific needs. The asset also includes a comprehensive maintenance utility that allows users to easily monitor and manage the model's performance. In conclusion, FUJI TECHNICA 3B-8P is a comprehensive, precision grinding, lapping and polishing equipment. This system provides users with a highly accurate, precise finish and is suitable for a variety of applications. The unit includes a number of user-friendly features that make it simple and convenient to operate.