Used ICHIKAWA ICB-800 #9269801 for sale

ICHIKAWA ICB-800 is a fully automatic wafer grinding, lapping and polishing equipment that can perform all the steps required for production of high quality Surface Acoustic Waves (SAW) and Bulk Acoustic Wave (BAW) devices. The system incorporates several advanced technologies that enable it to produce extremely consistent and precise results. The unit consists of a grinding stage, lapping stage, and polishing stage. The grinding stage utilizes a special CBN (Cubic Boron Nitride) wheel to remove surface material to create a flat surface on the wafer. The lapping stage incorporates a set of double-side lapping discs featuring a combination of abrasive diamond powder and a special lubrication fluid. This allows for uniform surface removal to create to a mirror-like surface finish on the wafer. The polishing stage is equipped with a specialized rotating polishing pad which enables precise control over the polishing cycle. This ensures that the polishing results are consistent from one wafer to the next. ICB-800 also incorporates a special "touch sensor" device which enables it to easily detect and correct any minor surface anomalies that occur during the polishing cycle. The machine also offers a number of advanced features that make it well suited for high-volume production runs. These include automatic wafer loading and unloading, wafer orientation, and advanced programmable parameters. These features ensure that the tool can provide superior throughput and productivity during production of large quantities of wafers. ICHIKAWA ICB-800 also offers a variety of safety features designed to help protect the operator from potential hazards during operation. These safety features include protective shields, interlocked doors, and emergency stop buttons for quick response in the event of a malfunction or other unexpected situation. Overall, ICB-800 is an extremely well designed and sophisticated wafer grinding, lapping and polishing asset that is capable of consistently creating high quality SAW and BAW wafers for the mass production of various devices. Its advanced features and safety systems make it an excellent choice for companies looking to create high quality wafers on a large scale.