Used ICHIKAWA ICB-800 #9269802 for sale

ICHIKAWA ICB-800 is a wafer grinding, lapping and polishing equipment, commonly used to fabricate semiconductors and other microelectronic components. ICB-800 employs a high-speed angle-adjustable grinding head, enabling precise grinding of wafer surfaces at predetermined angles. Using an integrated control system, ICHIKAWA ICB-800 creates a constant lapping and polishing force on the wafer surface while positioning the grinding head at variable angles as desired. Additionally, the uniformity of lapping and polishing forces is maintained with AUTOGRIP, a load control unit that optimizes lapping and polishing performance. The mechatronic features of ICB-800 enable high throughput grinding, refining and polishing of wafers with optimal precision. Equipped with a superior bias control machine, ICHIKAWA ICB-800 enables precise wafer grinding, lapping and polishing to exact angles and dimensions. Wafers can also be held in place by the pneumatic saw ejection tool, providing secure and precise processing. ICB-800 is designed for precise, intensive grinding, lapping and polishing of wafers while ensuring optimal work stability. Its integrated DC/AC motor offers immediate speed response and smooth, continuous motion. ICHIKAWA ICB-800 also makes use of high-speed automatic grindstones, which optimize grinding speed and eliminate clogging. In terms of safety, ICB-800 is equipped with an Emergency Stop Button, guaranteeing immediate stoppage of operation in case of an emergency. The grinding head has an integrated Protective Guard, while a Protective Shield tailored to the shape of the grinding head is also equipped. Overall, ICHIKAWA ICB-800 is a reliable, efficient and precise wafer grinding, lapping and polishing asset that guarantees safe and accurate results. The integrated AUTOGRIP, DC/AC motor, bias control model, pneumatic saw ejection equipment, Emergency Stop Button and Protective Guard/Shield make it a versatile, productive and user-friendly machine.