Used KOYO DXSG 320 #9152119 for sale

KOYO DXSG 320 is a state-of-the-art wafer grinding, lapping and polishing equipment. Featuring a highly-controlled grinding and polishing process, DXSG 320 is capable of high-performance edge grinding, precision lapping, and surface polishing at an exceptional rate of speed. The integrated grinding center features an advanced three-axis linear controlled grinding spindle, capable of high angular accuracy, high-performance grinding, and finish grinding of the edges of wafers with a remarkable level of speed and consistency. This is accomplished using an integrated grinding diamond for superior grind performance, highly-sophisticated lapping technology to ensure the finest precision, and a polishing compound to ensure a superior finish to each wafer. In addition, KOYO DXSG 320 is equipped with a highly automated control system. Based on a graphical user interface, this unit allows the user to monitor and manage the entire grinding, lapping, and polishing process in real-time, allowing for increased efficiency and superior wafer quality control. Also, DXSG 320 features a special rotating chuck machine to automatically rotate and position each wafer in the grinding or polishing process, allowing for consistent product quality throughout the process. Furthermore, the tool utilizes an advanced automatic grinding and polishing method that allows the user to preset the desired parameters for each individual wafer, eliminating the need for manual adjustment. Overall, KOYO DXSG 320 is an advanced wafer grinding, lapping, and polishing asset that guarantees superior wafer quality through a fully-automated, highly-controlled grinding and polishing process. With advanced technology and automation, DXSG 320 increases the speed, consistency and overall quality of the grinding and polishing process, allowing for exceptional wafer quality at an exceptional rate of speed.