Used KOYO R631DF #9269526 for sale

KOYO R631DF is a state-of-the-art wafer grinding, lapping and polishing equipment specifically designed for medium- to large-sized wafers. This system can be configured to accommodate wafers of various sizes, shapes, and thicknesses. It features an integrated optical profilometer and ion-beam etching capabilities, which maximize precision and efficiency. The unit includes a separate control cabinet, grinding station, and wafer loader. The grinding station utilizes three spindles, each equipped with an R631DF diamond wheel and a grinder wheel, for processing wafers. The wafer loader then takes the resulting wafer, if it is a large quantity production wafer, and loads it into the grinding station for processing. During this time, the machine automatically clamps and holds the wafer in a secure, accurate position prior to the grinding process. Once the grinding and lapping process is completed, the wafer is then passed through the ion-beam etching station. This station utilises an ion beam to create smooth and uniform surface pattern of the wafers. Additionally, this station also applies the necessary polishing to the wafer, resulting in an enhanced surface finish. Finally, the tool is also equipped with an optical profilometer, which is used to measure the physical properties and surface contours of the wafers in the asset. Once the wafer is completely processed and cleaned, it is discharged and goes through further inspection to verify the quality of the wafer. The model is also designed to be easy to operate, with a user-friendly control panel that provides easy operation and control of all equipment components. KOYO R631DF is designed to process large-sized wafers in a fast and precise manner, with higher yields and less error. This wafer grinding, lapping and polishing system provides superior results at lower costs, providing a long-term investment for companies looking to improve their wafer production.