Used KOYO R631DF #9282444 for sale

KOYO R631DF is a wafer grinding, lapping & polishing equipment designed to process a variety of hard materials with consummate precision. Featuring a modular design, the system is capable of carrying out multiple tasks like substrate cleaning, lapping, grinding, polishing and other operations needed in advanced semiconductor production. It is driven by precision motor encoders and modules for controlling speed that ensure the finest surface finish and accuracy across the length and width of the wafer. This makes it particularly suitable for ultra-precision machining operations. The unit comes with disposable platen pads for preventing cross contamination between different materials while the grinding and polishing operations are carried out. It has an integrated chiller machine to maintain temperature uniformity and reduce warping in finished wafers. The air bearing spindles are designed to deliver ultra-smooth operation for ultra-precise surface processing. The spindles are direct drive giving low inertia and high accuracy. Further, it has an advanced computerized monitoring tool that can be integrated with automated process control algorithm for improved productivity. The asset has in-line process measurement capability to evaluate the performance in real-time and enable quick process adjustments. Real-time monitoring features also ensure that the wafers are consistently processed as per predetermined uniformity and accuracy specifications. To further enhance its capability, the model has a unique multi-axis robot that can be used for loading and unloading the wafers, and automatically orienting the wafers in the platen in an optimum position. The equipment is designed for enhanced safety with all operating controls safeguarded against access by unauthorized personnel. Overall, R631DF is a precise, flexible and user-friendly solution for semiconductor manufacturers that need fast, accurate and reliable wafer grinding, lapping & polishing operations.