Used NAGAGATA UTS-3 #9378344 for sale

NAGAGATA UTS-3 is a wafer grinding, lapping & polishing equipment from NAGAGATA. It is designed with a range of features that enable it to grind, lap and polish wafers quickly and accurately. The system offers a fully automated wafer grinding solution with a wide range of options that make adjustment and customization of the grinding parameters easy. UTS-3 unit is able to automatically adjust its settings to meet the required grinding and polishing characteristics of the desired finish for a wide variety of different wafers, including quartz, sapphire, fused silica, and lithium disilicate glass. The machine boasts an intuitive graphical user interface which enables operators to easily configure the grinding parameters. This feature-rich tool is constructed using a range of advanced materials to ensure long-term reliability. The grinding asset uses a high-powered stepper motor which is driven by a direct drive servo motor, providing precise positioning and precision control during operation. The lapping and polishing systems employ an in-line mechanism to ensure uniform movement over the wafer surface, reducing vibration and providing a consistent finish. The model is designed to run constantly with temperatures ranging from 10 to 45°C. The versatility of NAGAGATA UTS-3 equipment is enhanced by its inability to metrology capabilities, which enable it to measure both the shape and roughness of the wafers before and after the grinding process. The system also has the ability to separately calculate the size, thickness and tolerance of each wafer before and after grinding. Overall, UTS-3 provides a cost-effective solution for wafer grinding, lapping and polishing. It offers a reliable, repeatable and consistent finish which ensures the quality and integrity of the final product. Operators benefit from intuitive graphical interface and easy access to settings and data. With the unit's ability to measure metrology results, operators can easily evaluate and optimize the grinding and polishing process, resulting in cost-effective wafer production.