Used NANOTECH 250 UPL #9153367 for sale

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ID: 9153367
Vintage: 2009
Single point diamond turning lathe Optical tool setting system Dual nose tool post Chiller (Recently upgraded fan motor) Vacuum zone: 119 mm Flat vacuum chuck: 150 mm Electronic gauge head with stand Nano meter Nano balance (3) Axis: X, Z, C Resolution: 0.01 nm linear / 0.0000001° rotary spindle: 50-10000 RPM, bi-directional Axial & Radial motion accuracy: ≤12.5nm Box way slides with brushless DC linear motors Delta TAU control system FANUC Style programming Optical tool set system (2) Dual nose fine adjust tool post Spindle chiller Quad spray mist (2) Single spray mist (4) Simultaneous spray mists Vacuum reverse Vacuum chuck, 150mm Nanometer Electronic gauge head with stand Programmable high / low vacuum Air bag vibration isolation mounts Nanobalance Renishaw MP250 touch probe Facility for fast tool servo (ports etc) Nanocam: 2D V1.38 Diffsys: V4.38 Used for cutting: Zinc Selanide Zinc Sulphide Germanium Silicon PMMA Zeonex MR7 Copper Aluminium Naval brass 2009 vintage.
NANOTECH 250 UPL is a wafer grinding, lapping and polishing equipment designed for single-piece and small-volume production runs. This system can be used for a wide range of materials such as silicon, quartz, and metals, making it an ideal choice for a variety of industries. 250 UPL comes equipped with a 1.4 kW spindle that provides high-precision and reliable grinding and polishing, with a resolution of 0.01 µm or less. The unit also features a process chamber with a full range of motion, making it capable of processing substrates up to 213 mm in diameter and up to 1 mm in thickness. The machine also has a controller to ensure process stability, and an integrated vision tool for fast inspection cycles. NANOTECH 250 UPL also comes with a four-axis stage that is designed to be compatible with a variety of grinding and polishing tools such as diamond heads and hybrid wheels. The asset also features adjustable process parameters for critical process steps, allowing users to easily control and adjust parameters for different applications. 250 UPL also offers users a wide variety of features aimed towards increasing productivity and efficiency. These include an integrated autofeeder, automatic process control, and an advanced vacuum model. The equipment also has a cycle time of less than one minute, making it ideal for high-volume production runs. NANOTECH 250 UPL system is a highly advanced and reliable wafer grinding, lapping, and polishing unit. It offers users maximum process control and precision, and is designed to produce high-quality surfaces at a rapid rate. The machine also is designed to be both easy to operate, as well as efficient, ensuring users are able to get the most out of their production runs.
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