Used NANOTECH 380 #119018 for sale

NANOTECH 380 is a precision wafer grinding, lapping and polishing equipment for applications in semiconductor, MEMS, and optical device manufacturing. This system is built with a robust and highly modular structure to provide high accuracy and performance in applications ranging from rough grinding to ultra-fine polishing and lapping. The unit utilizes nanoscale blades composed of diamond, boron nitride, silicon carbide, and other materials to grind, lap, and polish the surface of the wafers. A robotic arm is responsible for mounting and controlling the nanoscale blades at a high speed and precision. In addition, the robotic arm is able to deposit abrasion particles between the wafers and the blade surfaces. The machine has a configurable workflow engine to ensure all operations are performed with the best possible accuracy and throughput. This includes powerful simulation capabilities for predicting the results of the process. A comprehensive set of sensors and controllers are also employed to perform closed loop feedback control of the process, ensuring high tool accuracy and repeatability. 380 is equipped with an intuitive user interface and multiple configurable options for accommodating different types of wafer geometries and applications. The tool facilitates a sophisticated process monitoring, allowing for real-time optimization of the process parameters and conditions. NANOTECH 380 asset is engineered for minimal maintenance and downtime, providing higher uptime and enhanced workflow efficiency. This model is also designed with advanced safety features, such as finger protection, low-risk blade feeding, and multiple safety interlock features. This equipment is an ideal tool for applications that require high precision and repeatability in wafer grinding, lapping, and polishing. Its consistent accuracy and performance makes 380 an entirely reliable solution for achieving nanoscale fabrication of wafers and other materials.