Used NANOTECH NSP-610P #9156571 for sale

NANOTECH NSP-610P Wafer Grinding, Lapping and Polishing Equipment is a fully automated, multi-purpose, process-intensive system designed for precise and repeatable grinding, lapping and polishing of semiconductor wafers and various other substrates. The unit features a High-Power Ultrasonic grinder for efficient, distributed grinding, along with a built-in grinder for abrasion and stress relief grinding. The lapping and polishing functions are provided by a single-stage, fully automated lapping/polishing station, which uses a polishing pad to perform both lapping and polishing. NSP-610P machine is an ideal tool for efficient and accurate processing of small, medium, and large substrates. The tool is built around a precision 3-axis industrial robot, which provides convenient and safe handling of the substrates, with a maximum cycle time of 10 minutes. The robot is also designed for easy integration of additional automation systems for loading and unloading. In addition, the asset is fully compatible with standard process protocols, supports up to 25 preset parameters, and is programmable for custom process protocols. NANOTECH NSP-610P model offers a range of features to optimize the grinding, lapping and polishing process for a particular application. The Multi-Nozzle Ultrasonic Grinder allows for options of varying grinding types, including wheel-type, drill-type, and diamond-tipped grinding for different material removal rates and surface finish characteristics. The thickening index (TI) and lapping/polishing speed, including rough and fine surface polishing, are independently adjustable to ensure that the desired surface quality for each substrate is achieved. The equipment is equipped with a programmable edge protection alarm to ensure that any grinding/polishing beyond the die edge is stopped, thus eliminating risk of damage to the die. Additionally, the system is equipped with advanced diagnostics and is built of high-quality components to ensure long-term reliability. The unit also offers convenient, precise, and intuitive control, using a 9-inch touch screen and a joystick for fine-tuning the process. NSP-610P machine offers superior performance and is an ideal tool for achieving consistent and accurate processing of semiconductor wafers or ultrathin plates, and is well-suited for applications in aerospace, automotive, electronic, and medical industries.