Used NANOTECH NSP-610P #9224529 for sale

NANOTECH NSP-610P
ID: 9224529
Single side polishing machine (2) Head Forced drive head Vacuum head Surface plate: 610Φ.
NANOTECH NSP-610P is a wafer grinding, lapping, and polishing equipment designed to provide a high level of precision. This system is designed to suit the requirements of a wide range of applications, including manual and automated procedures. The unit operates via a motor that is connected to a vacuum pump and a grinding wheel. The grinding wheel is covered with an abrasive material, such as diamond powder or alumina oxide, to create a highly precise finishing. Furthermore, the machine has a built-in cooling tool which helps to prevent overheating of the motor. NSP-610P is capable of providing accurate flat surface finishes from light roughness (Ra 0.45 µm) to mirror polish (Ra 0.01 µm). Furthermore, the asset has the capability to grind to a depth of 0.3 mm with one pass. The model is able to grind with minimal grinding force, which prevents damage to soft materials such as fused silica wafers. NANOTECH NSP-610P is designed with automated processes to make it efficient and easy to use. This automation can be adjusted for the optimum results in the characteristics of the grinding and polishing surface. The equipment also has a safety feature that allows it to sense an overload and immediately stop the process. This system has a wide range of accessories to provide flexibility such as gas handling systems, manual or servo driven stages for automatic grinding/polishing, and ancillary equipment such as ovens, water chillers, and tanks. With this flexibility, NSP-610P can handle various production needs. To ensure accuracy and precision, NANOTECH NSP-610P comes with an alignment unit and air-bearing that is adjustable to as low as 6 μm. The machine also has an auto-alignment tool to ensure that the machine is in a level plane during operation. NSP-610P has a variety of control options, including a manual or automated control asset. The user can save grinding and polishing parameters to the control software for easy recall. NANOTECH NSP-610P wafer grinding, lapping, and polishing model is an efficient and precision equipment that is designed to meet a variety of applications. It is an automated system that is operated with minimal grinding force, allowing for high quality results. This unit is designed to handle a wide range of applications, featuring a variety of accessories, adjustable air-bearing, and an auto-alignment machine for precise and accurate operation.
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