Used OKAMOTO OGM250EX #9375278 for sale

OKAMOTO OGM250EX is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for precision and high-volume production of wafers for the semiconductor industry. The system features a three-axis linear-motor-driven robotic head that allows for production of wafers from substrates up to eight inches in diameter. Additionally, the integrated wafer-handling subsystem enables high-speed loading and unloading of wafers and supports continuous high-volume production. The grinding and lapping process begins with a coarse grinding operation using high-quality abrasives to create a smooth surface. This is followed by a lapping process, in which metal bond or resin bond diamond and aluminum oxide abrasives are used to achieve a polished and highly precise surface finish. To complete the process, a polishing step is used to further refine the surface and achieve the desired characteristics. OGM250EX is easily set up and operated with a user-friendly graphical interface that allows for easy access to unit parameters. It is also equipped with an integrated automatic cleaning machine that reduces wafer-fabrication downtimes. The tool's design also includes several safety features that help ensure the safety of operators, such as an emergency-stop switch, safety covers, and an advanced safety monitoring asset that has the capability to detect overload and to shut down the model if it senses any unexpected events. Performance of OKAMOTO OGM250EX is further enhanced via the incorporation of advanced diagnostics and extensive maintenance protocols. Maintenance of the equipment is simple and easy with a tool-less cleaning system. OGM250EX also hosts an intuitive software program that allows for quick setup and process-parameter changes. Additionally, OKAMOTO OGM250EX includes a process-automation feature that automates the unit's activities, allowing for high-volume production. To conclude, OGM250EX is a precision wafer grinding, lapping, and polishing machine with a three-axis linear-motor-driven robotic head, featuring advanced safety features and a user-friendly graphical interface. Optimized for high-speed loading and unloading, the tool hosts a sophisticated process-automation feature that enables continuous high-volume production. OKAMOTO OGM250EX provides users with intuitive and efficient operation, as well as easy maintenance and cleaning. It is a top-of-the-line asset for the semiconductor industry.