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Wafer Grinding, Lapping & Polishing
OKAMOTO
OGM250EX
Used OKAMOTO OGM250EX for sale
Wafer Grinding, Lapping & Polishing
Manufacturer
OKAMOTO
Model
OGM250EX
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OKAMOTO
OGM250EX
Cylindrical grinding machine Maximum machining diameter: φ200 Center distance: 500 mm.
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