Used RETSCH BB 200 #9158782 for sale

RETSCH BB 200 is a robust and powerful wafer grinding, lapping, and polishing equipment designed to provide maximum accuracy and consistency. It allows for high-precision and repeatable performance results when processing thin crystalline wafers. The system features a drive base that supports a lapping and polishing head that spins at up to 2,000rpm and moves in two axes. The rotary motion and x-y movement of the head is precisely controlled by a user-friendly, high-resolution control unit. The machine also incorporates a grinding wheel to remove excess material from the wafer's edges, further aiding the precision of the lapping and polishing. This is especially advantageous when working with products that require a high level of precision, such as in the fabrication of integrated circuits. BB 200 provides a maximum grind speed of 100mm/s and minimal overspray during processing, allowing for efficient and accurate preparation of wafers. It is also equipped with a build-in vacuum tool which allows for ingestion of excess particles produced during grinding and lapping. Additionally, it has a flexible magazine that can store up to 80 wafers of varying sizes with a minimum size of Ø50mm and a maximum size of Ø100mm. For users' convenience, RETSCH BB 200 comes with a visual touchpad display, allowing for monitoring of the lapping and polishing process in real-time. BB 200 was designed to be a reliable and high-performance asset for the preparation of thin crystalline wafers for application in precision electronics. It can handle wide range of wafer materials with an adjustable stroke length and cutting depth. All of which makes RETSCH BB 200 an ideal choice for precision wafer grinding, lapping and polishing applications.