Used SATISLOH A-II #9241375 for sale

SATISLOH A-II Wafer Grinding, Lapping & Polishing Equipment is an automated system used in semiconductor production for grinding, lapping, and polishing of silicon and glass wafers. This unit is characterized by its high flexibility in terms of substrate geometries and material compositions due to its adjustable speed range and included linear and rotational axis capabilities. It offers features such as LED wafer inspection, integrated cooling and heating systems, and real-time feedback on results. A-II machine can handle wafer sizes up to 250mm in diameter using standard silicon grinding and lapping tools and processes. It also offers the capability to grind single-sided or double-sided wafers on both cylindrical and flat surfaces with high accuracy and repeatability. The grinding station provides uniform and repeatable results with minimum variation due to its adjustable speed range and two linear and two rotational axes. The lapping station, on the other hand, is capable of combining a wide variety of techniques and materials to achieve desired results. For example, an internal body force is applied to achieve an optimal pressure distribution and therefore the success of the process. It also enables high accuracy results due to its adjustable speed range and its ability to compute the exact number of revolutions required for a given wafer. The polishing station of SATISLOH A-II is the most advanced station and provides polished surfaces with virtually no defects and then characterized by its ability to eliminate surface steps. It can also eliminate all contamination and scratches using a combination of techniques such as ultrasonic slurry, di-electric slurry, and brush polishing. In addition, its linear and rotational axes provide precise control and adjustment for ideal surface finishes. Finally, the LED wafer inspection station offers a full image of the wafer, as well as detailed measurements and analysis. It is capable of detecting any flaws in the surface and can be used for device characterization. A-II represents the best in the semiconductor industry for wafer grinding, lapping, and polishing. It provides the highest flexibility and accuracy for processing of a variety of wafers with a range of substrates. Its unique and advanced features provide a highly reliable and repeatable tool, making it an essential asset for any productive facility.