Used SATISLOH Auto-Flex #293589758 for sale

SATISLOH Auto-Flex is an advanced wafer grinding, lapping, and polishing equipment designed to provide the finest finish on semiconductor wafers. The system is configured to handle a variety of sizes from 2" to 12" diameter round wafers. The unit features a two-stage process that allows for simultaneous grinding, lapping and polishing. The first stage of the process utilizes a combination of polishing pressure, cooling water flow and coolant lubrication to create a consistent polished surface. The second stage employs a proprietary polishing pad with a unique CNC grinding and lapping head to several planes of perfect finish with edges so tight they appear invisible to the naked eye. This machine is constructed with a robust, fan cooled spindle motor, which drives the polishing pad and a dual function controlled motor which operates both the backing plate to hold a polishing pad and the lapping head that exposes the CNC grinding diamond segments for lapping. This combination allows for very consistent and precise results. Auto-Flex also features the most advanced cleaning tool available including the removal of any fines or dust prior to the polishing process. In addition to wafer grinding, lapping & polishing, the asset offers the ability to evaluate onsite the quality of the finished wafer surface, as well as its overall flatness. SATISLOH Auto-Flex model provides easy operation, highly accurate control, and long term repeatability in the most demanding semiconductor processing environments. It is designed to deliver the highest quality finish while consuming low energy and meeting stringent environmental standards. The equipment also includes a post processor that optimizes the wafer finish and shape through variable frequency drives (VFD) which can be programmed for specific wafer sizes, optimum uniformity and straightness. This allows for the production of consistently high quality wafers. Auto-Flex is the ultimate system for semiconductor wafer grinding, lapping, and polishing and provides the highest quality, repeatable results for wafer processing.