Used SATISLOH Auto-Flex #293608255 for sale

ID: 293608255
Vintage: 2010
Polisher 2010 vintage.
SATISLOH Auto-Flex wafer grinding, lapping and polishing equipment is a fully automated machine designed to easily prepare a variety of materials for various applications. The machine is capable of processing any type of rigid material such as quartz, ceramic, semiconductor and opto-electronics substrates. The system features an advanced design that optimizes space-saving, labor-saving, and cost benefits. It is configured for precision blind and dicing operations with a high degree of control accuracy, reliability and repeatability in the production process. The unit starts by preloading the wafers into the cassette vacuum chuck. Following the cassette loading, the wafer picking unit takes one wafer from the cassette and puts it onto the spindle. The wafer is then indexed and the polishing pressure started. The polishing process is managed by a programmable ring mounted on the spindle. The spindle is also equipped with an advanced robot arm that scoop-grinds, lapping, and polishing of the wafer according to the program that has been set up. The chuck is then closed and the wafer is ground to the desired specifications. The entire process is supervised in real-time using a digital touchscreen. Through the touchscreen, a wide variety of parameters can be adjusted such as rotating speed, grinding pressure, and polishing pressure. At the end of the grinding process, the wafer is removed from the spindle and sent to the cleaning station. Here, the wafer's surface is cleaned using a combination of hydrojet and vacuum with a pressure recirculation machine that ensures a clean and precise final product. The polish process completes the finishing and produces an ultra-smooth surface on the wafer material. After the polish is completed, the wafers are inspected for non-uniformity. The excessive non-uniformity is then adjusted by a programmable ring. Finally, the automatic unloading tool sends the finished product to their appropriate destination. Auto-Flex wafer grinding, lapping and polishing asset provides an efficient and precise manufacturing process with optimal workflow management. The high level of automation and programmability makes it suitable for a variety of applications, and its energy-saving design minimizes overall production costs. In conclusion, SATISLOH Auto-Flex model is an ideal solution for various industries as a perfect medium to finish and process various materials with a high degree of accuracy, repeatability and reliability.
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