Used SATISLOH Auto-Flex #293618556 for sale

SATISLOH Auto-Flex is an automated precision wafer grinding, lapping and polishing equipment specifically designed and built for precision applications in semiconductor, optoelectronic and microelectronic industries. This system utilizes robotic wafer handling for the automatic grinding, lapping, and polishing of wafers and other sensitive substrates, ensuring high accuracy and repeatability of each substrate. Auto-Flex unit from SATISLOH offers multi-functional capabilities, allowing users to reduce their processing time and improve the surface quality of their products. SATISLOH Auto-Flex machine from SATISLOH consists of a robust optical handling tool, a sophisticated control platform and a grinding, lapping, and polishing process module. With the flexible, modular design, the asset can be tailored to fit the specific process requirements of each individual application, allowing it to produce high-quality results with maximum surface roughness of 1µm. Auto-Flex model also allows for the integration of feature recognition and alignment stations that are capable of faster and more accurate wafer positioning. The integrated chemical processing module that is included with SATISLOH Auto-Flex equipment is specifically designed to be operated independently of the main system and allows for the automated processing of wafers with high levels of accuracy and repeatability. This ensures that users are able to precisely control contaminant free surface finish and total flatness of the processed substrates. In addition to this, the unit can be integrated with specialized process cycles such as edge grinding and deburring, allowing for higher levels of process automation and accuracy. This machine from SATISLOH is capable of handling any wafers ranging from 100 mm to 300 mm in diameter, providing the flexibility and range to meet the production requirements of each application. With its modular design, the tool is able to provide unparalleled process control and efficiency, resulting in consistently repeatable results. The asset operates on a closed-loop control platform and also provides optional vision systems that can be integrated to enable higher levels of accuracy. Overall, Auto-Flex model from SATISLOH is an efficient and highly repeatable precision wafer grinding, lapping and polishing equipment, providing users with a highly reliable and cost-effective solution for the processing of sensitive substrates. The system allows users to customize it to meet their specific applications, resulting in unparalleled results and repeatability.