Used SATISLOH Auto-Flex #293659093 for sale

ID: 293659093
Vintage: 2007
Polisher Calibration kit Spare parts 2007 vintage.
SATISLOH Auto-Flex is an automated wafer grinding, lapping & polishing equipment designed to offer machining solutions for a number of micro-technology applications. The system is highly versatile and can be utilized for processing of a wide range of materials such as ceramics, metals, plastics, and thin-film devices. The wafer grinding process in which Auto-Flex unit specializes utilizes diamond tools to grind intricate shapes into the semiconductor wafer. This process can provide an excellent surface finish with very little subsurface damage. The robust machine design helps ensure precision alignment of the tooling and part. The lapping and polishing of the wafer is essential for planarization and achieving optimal surface performance of the device. SATISLOH Auto-Flex tool is ideal for fine lapping and polishing as it utilizes two-sided planarization using an opposing or fixed abrasive lapping process which produces an excellent surface finish. The process can be automated with the addition of a dependable XY table and high-precision linear encoders for wafer tracking. The abrasive material used for diamond lapping/polishing is configured in an open-style diamond tooling asset. This open architecture allows for quick change of the diamonds and allows different diamond sizes to be used within the same tooling. Auto-Flex model is equipped with advanced integrated controls, allowing for full flexibility and quick response times. The intuitive and easy-to-use operating equipment allows users to quickly and confidently create a recipe without expert programming knowledge. Users of SATISLOH Auto-Flex system will benefit from low maintenance requirements and cost efficiency. The unit's robust construction and design enables it to handle a wide range of applications with minimal impact on production time and cost. Auto-Flex machine is an excellent choice for processes requiring accurate profile machining, lapping or polishing because of its many features. It is a reliable and cost-effective solution for various micro-technology applications.
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