Used SATISLOH Auto-Flex #293810785 for sale

SATISLOH Auto-Flex is an advanced wafer grinding, lapping and polishing equipment designed for wafer production applications. This automated system provides superior wafer precision, high throughput rates, and exceptional flexibility. By combining the benefits of both flexible and rigid platforms, Auto-Flex allows for simplified wafer handling, precision grinding, optimized lapping process, and superior polishing of the wafer surface. At its core, SATISLOH Auto-Flex utilizes a robot arm to maneuver and position wafers for various processes. This arm ensures a repeatable, accurate wafer placement that is crucial for precise fabrication. The flexibility of the robotic arm allows the unit to process wafers of various sizes and shapes, which helps to speed up results. Additionally, the machine allows for a variety of grinding, lapping and polishing operations, which makes it ideal for a range of wafer substrates including aluminum, silicon, and gallium nitrate. Auto-Flex utilizes a number of features to aid in the efficient, precise and effective grinding, lapping and polishing of the wafer surface. This includes a computer-controlled process automation tool, which ensures that every process step is completed with the utmost accuracy and repeatability. All wafer surfaces are then optically inspected with a 3D microscope, which confirms proper lapping and polishing. SATISLOH Auto-Flex enables high precision wafer grinding and lapping via a high-speed spindle motor and a polishing lap loaded with diamond abrasives. The spindle supports a wide range of grinding and lapping operations, including highly accurate grinding operations. The asset also features an automated smear prevention layer, which prevents contamination of the wafer surface during high speed grinding operations. In addition, Auto-Flex provides an integrated cleaning station, with both pulsed-jet and ultrasonic cleaning capabilities. This helps ensure that all wafer surfaces are clean and free of contaminants prior to polishing, giving the wafers a crisp, high-quality finish. SATISLOH Auto-Flex is equipped with a fully automated polishing process, with the ability to run multiple polishing programs simultaneously based on individual wafer requirements. This ensures optimal wafer accuracy and repeatability throughout the polishing process. Auto-Flex offers a flexible, precise and reliable solution for wafer grinding, lapping, and polishing operations. By providing superior process control, automation capabilities, and a wide range of polishing options, SATISLOH Auto-Flex enables efficient and consistent wafer fabrication. This highly automated model has revolutionized wafer production in terms of accuracy, throughput, and flexibility.