Used SATISLOH Auto-Flex #9277304 for sale

SATISLOH Auto-Flex is a high-performance wafer grinding, lapping, and polishing equipment designed to produce high-quality, smooth, and polished surfaces on a variety of wafers. It is suitable for a variety of lapping, polishing, and grinding operations. Auto-Flex is designed with a unique system that allows for automated, single-sided grinding and polishing of ultra-thin wafers. SATISLOH Auto-Flex unit is constructed with an industrial grade aluminum alloy and is designed to be robust and reliable. The machine is equipped with a servo-controlled three-axis linear guide tool and pneumatic centering compensating technology for precise, accurate grinding and lapping operations. The asset also includes two servomotors and a CAM drive for applying the perfect polishing force onto the wafer surface. The entire model is controlled with an intuitive user interface that allows for easy setup and operation. Auto-Flex equipment also provides a variety of grinding and lapping solutions. SATISLOH Auto-Flex can perform both single-sided and two-sided lapping and grinding operations that produce uniform surfaces and improved surface quality. The system can also be adjusted to grind and polish different wafer shapes and sizes with accurately controlled parameters. It is capable of performing operations without the need of expensive, time-consuming setup. The unit also includes an E-lighter, which is a heating and cooling process module that helps reduce the material temperature during grinding and lapping operations. The E-lighter also helps reduce the total process time by eliminating the need of manual grinding and lapping operations. In addition, Auto-Flex machine is equipped with an auto-load tool that allows for transfer of multiple wafers into the asset simultaneously. This reduces setup time and increases process speed and efficiency. It is also equipped with dust collection filters that ensure the wafer processing environment stays clean and safe. SATISLOH Auto-Flex is an advanced wafer grinding, lapping, and polishing model that is suitable for ultra-thin wafers. The equipment is designed with advanced features and mechanisms that provide a robust, reliable, and efficient wafer grinding, lapping, and polishing operation. The system is easy to operate and can produce uniform and smooth wafer surfaces and improve the surface quality of the wafers in a short time.