Used SATISLOH Auto-Flex #9302743 for sale

SATISLOH Auto-Flex is a cutting-edge wafer grinding, lapping, and polishing equipment, designed to provide superior processing capabilities with speed and precision. This dynamic system enables high volume wafer grinding, lapping and polishing with substantial savings in time and labor. Auto-Flex utilizes a patented CVC process which involves using a blend of synthetic diamond abrasives and high speed mechanical pressure to grind, lap, and polish wafers. It can be used to process a wide range of wafer materials such as silicon, polysilicon, gallium arsenide, and sapphire. The CVC process results in high quality surfaces with superior flatness, uniform optical properties, low cost-per-part, high yield, and improved process uniformity. SATISLOH Auto-Flex features a range of grinding discs or grinding blades up to 12 inches in diameter, and a wet grinding / lapping belt that offers a high precision wafer processing solution. It is capable of operating at up to 250 rpm, making it suitable for high-volume, high-speed applications. The machine also features a patented micro lapping technology for accurate and precise wafer thinning. Auto-Flex utilizes a C-hook process. This automated process allows for wafers to be loaded by the operator or robot, loaded into the grinding frame, rotated, and then the processing takes place in the grinding frame. The processed wafers are unloaded by the operator or robot, ready for further inspection or next step in the manufacturing process. The unit offers a variety of options to customize the wafer processing including single side or double side processing, variable speed and pressure settings for lapping, and an abrasive size buffer which provides the flexibility to match the abrasive size to the wafer material and desired finish. As a complete machine, SATISLOH Auto-Flex is capable of grinding, lapping, and polishing in a single process and can deliver enhanced surface finish with reduced labor costs and improved part yield. It is the ideal machine for enhancing wafers, with increased accuracy, productivity, and efficiency.