Used SATISLOH Auto-Flex #9302744 for sale

SATISLOH Auto-Flex is a state-of-the-art automated wafer grinding, lapping and polishing equipment designed to meet the needs of the most demanding production environments. The system is designed to quickly and efficiently grind and polish a variety of wafer materials, such as silicon, silica, and other semiconductor materials. Auto-Flex offers a complete range of grinding, lapping and polishing capabilities. The unit can be used to generate fine surfaces on hard, brittle materials such as silicon wafers. The wafers are secured to the lapping table by vacuum and the abrasive slurry is activated and applied to the wafer. The grinding wheel rotates and the table simultaneously moves up and down at the same speed. This enables the grinding wheel to grind down the surface of the wafer to the desired height. Once the grinding process is complete, the lapping process can begin. In the lapping process, the wafer is flooded with a polishing slurry which contains abrasive particles. This mixture is used to smooth out the surface of the wafer. The lapping table also rotates to ensure consistent polishing. Once the lapping process is complete, the polishing process begins. The polishing slurry is replaced with a special polishing paste. This polishing paste acts as a grinding aid and can remove dirt, dust, and other particles from the surface of the wafer. The polishing table is also used to reduce the surface of the wafer to a fine finish. SATISLOH Auto-Flex is capable of enabling repeatable, high-precision grinding, lapping and polishing operations with minimal manual intervention. It also features several advanced technological features such as a self-regulating cooling machine, a high-intensity illumination tool, and a patented automatic positioning asset. This model can also be used with a wide range of grinding, lapping and polishing consumables to meet the needs of the most demanding production environments.