Used SATISLOH Auto-Flex #9354588 for sale

ID: 9354588
Polishers, parts machines.
SATISLOH Auto-Flex is a precision wafer grinding, lapping and polishing equipment designed for use in the semiconductor industry. Suitable for a variety of wafer sizes, the system is fully programmable and can carry out multiple processes in one cycle. The machine features a modular design, allowing for easy adaptation and configuration to specific applications and is fully enclosed to ensure a clean working environment. At the heart of Auto-Flex is its integrated grinding and polishing unit, which allows the unit to achieve a high degree of surface finish. The unit can be configured with up to three lapping and polishing cassettes, allowing for lapping/polishing operations at different levels of precision. A multi-step operation of up to ten grinding/lapping/polishing steps can be stored and recalled at any time for maximum flexibility and efficiency. The machine is also equipped with AC servo motor drive for superior accuracy and repeatability. The tool can be used for various wafer grinding and polishing applications such as preparation for Flip Chip Bonding, Stress Relieving, and Contact Lapping/Polishing. SATISLOH Auto-Flex can also be used for Nondestructive and Electrical Testing, as well as for preparation of Surfaces for Etching. The asset offers advanced process control capabilities due to its ability to measure and analyze the wafers during the lapping/polishing operations. Auto-Flex is designed with safety in mind, featuring a safety interlock model, emergency stop button, and built-in safety guards for operator protection. It also offers flexible automation capabilities, allowing the equipment to be incorporated into automated wafer fabrication lines. The system also features programmable job storage and recall for increased productivity and flexibility. SATISLOH Auto-Flex is a powerful and reliable unit that delivers superior results. With its advanced features and superior flexibility, the machine is an ideal choice for grinding, lapping and polishing various wafer sizes in the semiconductor industry.
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