Used SATISLOH Duo-Flex #293817659 for sale

SATISLOH Duo-Flex machine is is a multi-purpose wafer grinding, lapping and polishing equipment that allows for precise and repeatable processing of numerous substrates. This equipment comes complete with an array of interchangeable process modules. The grinding/pumping station offers single or multiple grinding/polishing processes, as well as simultaneous operations, such as lapping, which allow for higher throughput rates. This system is designed to reduce manual labor and errors and improve wafer production efficiency and accuracy. Duo-Flex unit is both robust and flexible, offering a customized set of technology solutions to meet the specific needs of the user. It provides precise control of process functions, such as pressure, temperature and speed, to ensure optimal repeatability and reproducibility. SATISLOH Duo-Flex is designed for standard production purposes as well as automated production processes, making it an ideal choice for high-volume production. It offers several features, such as programmable recipes, an intuitive touch-screen control panel, real-time visualization, and full traceability of each process cycle. In addition, the machine offers wireless and Ethernet connectivity for process monitoring and integration of process data. Duo-Flex tool is designed with a 200mm wafer capacity, and is suitable for grinding, lapping and polishing wafers up to 100 microns in thickness. It is available in 14 types of process modules, including polishing pads, lapping plates, grinding plates and conditioning pads in diamond, cBN, paint, etc. With its modular design, one can choose the right module for any application. The process modules are driven by a high-torque motor that is capable of reaching a maximum speed of 1500 RPM. The asset includes optical and acoustic sensors for improved machine performance and process accuracy. It also has an integrated cooling model to maintain consistent temperatures. In addition, SATISLOH Duo-Flex is easy to use and configure. It comes with a user-friendly control console that allows for swift product selections, viewing of process data, and real-time diagnostics. It can be operated remotely, via a PC, and boasts a high-contrast color display for easy monitoring. Duo-Flex wafer grinding, lapping and polishing equipment is a cost-effective solution for precise and repeatable processing of diverse substrates. It features a host of advanced features and reliable technology, enabling users to achieve optimal results.