Used SATISLOH Duo-Flex #9394939 for sale

SATISLOH Duo-Flex is a state-of-the-art wafer grinding, lapping and polishing equipment from SATISLOH. This system makes use of a dual spindle design and two separate grinders, allowing it to work on multiple wafers at once. This is done by rotating the wafers in different directions and adjusting the speed, resulting in extremely efficient wafer processing. To begin, the wafers are loaded into the grinding chamber with the top and bottom clamps. The grinding chamber automatically adjusts for height and width to ensure proper fit of the wafers. A set of calibration rollers is then used to determine the proper orientation of the wafers in the grinding chamber, ensuring even pressure for uniform grinding. The process then utilizes several unique technologies to ensure precise and effective grinding. The first of these is Duo-Flex process, which combines two counter-rotating grinding surfaces and enables simultaneous lapping and polishing with great precision. A patented "Isopolar" grinding process further improves wafer quality, making use of two separate, electrically opposite grinding discs to eliminate static charge and edge rounding. Finally, the unit also includes a patented "Intelligent Plane Detection" machine, which monitors the wafer's surface during grinding and automatically adjusts the grinding wheels for a precise finish. This process allows for higher throughput and reduces the number of imperfections in the finished product. SATISLOH Duo-Flex is designed to work in a wide range of industries, providing a powerful and reliable machinery for the production of wafers with a precisely machined surface. With its dual spindle design and combination of advanced features, Duo-Flex is an incredibly efficient way to quickly achieve surface finishes down to 0.2 µm.