Used SATISLOH Duo-Flex #9411240 for sale

SATISLOH Duo-Flex is a Wafer Grinding, Lapping & Polishing equipment designed to enable production at higher throughputs, precision and consistent results. This system utilizes two independent grinding tracks, which can be operated in tandem or in succession. Duo-Flex operates at high speeds and low dispersed emissions, enabling smooth, continuous processing of wafers of up to 8-inch (200 mm) diameters. The motion control unit of SATISLOH Duo-Flex offers precise parameters which can be easily set and adjusted, allowing automated processing of materials of various levels of hardness. Duo-Flex offers the flexibility to process wafers in single- or multiple-step mode. In single-step mode, flakes are removed in one single pass, while multiple-step mode provides greater precision in the surface preparation. In this mode, the grinding, lapping and/or polishing processes are divided into two or more steps, using different abrasives or compounds. This machine accommodates different types of grinding wheels and polishing materials, including amorphous diamond, diamond-filled Resin, CMC or Ceramic-based polishing compound. These allow the wafers to be polished to different levels of surface roughness and roughness averages, depending on the application and tolerance requirements. The abrasive and polishing materials can be easily changed manually or automatically with the monitoring of the associated parameters. SATISLOH Duo-Flex also offers a fine-tuning mechanism that includes a diamond dosing tool and a vacuuming station. The diamond dosing asset enables the exact amount of diamond compound to be dispensed on the wafer specific to the material characteristics, while the vacuuming station removes surplus materials for easy cleaning and maintenance of the model. Moreover, Duo-Flex is equipped with an inspection station. This station scans images of the processed wafer and evaluates both topography and surface condition. This feedback allows operators to make any required parameter modifications on-the-spot, enabling the replication of ideal conditions across repeat processes. In conclusion, SATISLOH Duo-Flex is a powerful and highly capable wafer grinding, lapping and polishing equipment. Its high speed, precision control and flexibility enable high throughput, fine-tuning capabilities and consistent results.