Used SATISLOH i-Flex #293684277 for sale

SATISLOH i-Flex is a state-of-the-art wafer grinding, lapping and polishing equipment that can range from single wafer processing to large scale production. This system is designed to provide industry-leading process performance and efficiency while reducing tedious manual operations associated with traditional grinding systems. I-Flex also offers the flexibility to work on a wide variety of material types and sizes. The unit's integrated structural design is built for long-term durability and reliable operation. It utilizes a simple, modular layout and integrated process algorithms that optimize grinding path and reduce energy consumption while maximizing throughput. This ensures accuracy and repeatability while keeping maintenance and downtime to a minimum. SATISLOH i-Flex also offers an adjustable spindle speed that can be adjusted to produce different wafer profiles and enable the user to fine-tune the wafer's profile for better overall performance. The grinding process begins by loading the wafer onto the mounting fixture after it has been prepared for grinding with other tools such as a UV ozone cleaner. Once the wafer is mounted, the grinding process starts. The spindle rotates at up to 3,000 RPMs, while a grinding disc controls the motion of the fixture to ensure optimum grinding performance. The machine then utilizes abrasive lapping pads of various grits and textures to achieve the desired wafer surface finishes. These pads have a unique lubricant incorporated to reduce heat build-up and improve the lifetime of the equipment. Once the desired surface finish is attained, i-Flex performs a cleaning process. This is to remove all of the grinding debris so that no residue is left on the wafer. Following this, the tool will then proceed with the polishing process. This is completed using polishing cloths and a diamond suspension lubricant. Before beginning the polishing process, the asset adjusts the pressure and velocity depending on the material and size of the wafer being processed. The polishing process is designed to deliver a greater level of surface finish with a higher degree of accuracy and uniformity. Finally, SATISLOH i-Flex will complete the final phase of the process by using an advanced multi-layered drying model. This will ensure the wafer has an even, uniform finish with no residue left behind. This efficient process can be used in several industries such as the semiconductor, data storage, LED lighting and photovoltaic industries to produce more reliable and precise components.