Used SATISLOH i-Flex #293793622 for sale

SATISLOH i-Flex wafer grinding, lapping and polishing equipment is a unique machine - a combination of longevity and durability, robustness, high grinding, lapping and polishing performance, flexibility, low abrasive consumption, and minimal maintenance effort. I-Flex system uses diamond grinding, lapping and polishing processes that operate with a specially designed abrasive film for wafer surface treatments. This unit features a 6-axis robotic arm, an adjustable manual loader and unloader, fluid management systems and an automated process controller. The flexible design of this machine enables it to be used with various sized substrates, from 50mm x 50mm up to 200mm x 200mm, up to a maximum apeture of 7mm x 12mm. It offers precise control over the grinding, lapping and polishing process, and because of its high modularity, user-specific requirements can be implemented. The grinding and polishing head can be adjusted to ensure precise alignment between the abrasive rollers and the substrate. The drive motor speed can be flexibly adjusted based on the part geometry and it can function on both minimal load and high-load parts. SATISLOH i-Flex tool also includes a wide range of automated processes, such as edge profiling, backgrinding and polishing, so that processes can be completed in the most efficient manner possible. The batch-processing capability allows for multiple wafers to be processed at the same time. I-Flex's modular design makes it very flexible and user-friendly, allowing manufacturers to expand their production capabilities as required. The asset is easily integrated into existing production lines. It also requires minimal maintenance effort and provides a cost-effective solution for high-volume production or unique substrate processing applications. SATISLOH i-Flex model is a reliable and durable equipment that can be used in different grinding, lapping and polishing applications. Its modular design allows for easy customization, and its intuitive user interface makes it easy to operate. It is a highly efficient and cost-effective solution for wafer grinding, lapping and polishing.