Used SATISLOH Micro-Flex #9357178 for sale

SATISLOH Micro-Flex is a state-of-the-art wafer grinding, lapping and polishing equipment. This advanced system offers full automation for a variety of wafer grinding and polishing operations. Micro-Flex unit can be used to manufacture small and large silicon, fused silica, semiconductor, optical, and ceramic wafers. The machine is designed for maximum precision and offers true flexibility with a variety of process options and configurable settings. SATISLOH Micro-Flex tool features a all-in-one design and is controlled by a single cable connection, giving a compact and efficient setup. The machine has a grinding spindle with a speed range of 500 to 1000rpm which allows for fine adjustment to suit the individual process. Micro-Flex is equipped with an assortment of tooling for each wafer grinding process, such as a diamond dresser and truing tools for grinding, a rubber lap for polishing, and abrasive lapping wheels. The flexible, modular controller of the asset allows for easy setup and adjustment of the grinding and polishing process, giving users total control over the perameters of the process. It also provides high accuracy position control, allowing for precise wafer positioning. SATISLOH Micro-Flex model is designed for superior performance and quality, thanks to the precision ground components and air-bearing spindle design. The rigid design eliminates chatter and vibration, allowing for smooth surface finish and excellent surface uniformity. The equipment is also equipped with an automated water-cooled system which ensures maximum process cooling. The reliable and durable design of Micro-Flex unit helps it provide decades of reliable service. The integrated ergonomic design makes it easy to use and the low maintenance costs are a major benefit. The robust design also ensures that the machine can operate in a range of conditions and harsh environments. All in all, SATISLOH Micro-Flex is a highly advanced wafer grinding, lapping and polishing tool that offers high precision, maximum flexibility, and a range of features for accurate and repeatable wafer production. It is an ideal solution for industrial and research applications, as well as for high-end consumer products.