Used SATISLOH P Matic 16 #9362221 for sale

SATISLOH P Matic 16 is a wafer grinding, lapping and polishing system that simultaneously processes both ceramic and semiconductor wafers, providing a complete edge grind, lapping and polishing in one compact operation. This machine includes features such as a ground breaking, angle-adjustable abrasive wheel for uniform, consistent edge grinding, a high-precision lapping head with up to five diamond lapping disks for lapping and polishing, a touch screen that simplifies programming and operation, and a modular design with separate loading/unloading and wafer processing compartments that allow the operator to focus on a single operation, while the machine performs the other operations in the background. At the core of the machine is an advanced PLC system that provides a range of motion and precision control with customizable parameters and steps. The PLC controls all stages of the process, from edge grinding to lapping and polishing, and ensures consistent quality. Additionally, the machine uses high-precision gauges to measure the edge profile as well as the lapping thickness and surface finish of the processed wafer. The machine follows a three-step process. Firstly, edge grinding is performed using a specially designed abrasive wheel, which works to quickly and uniformly remove the wafer edge. The wheel can be adjusted to match different edge angles, ensuring complete uniformity of the wafer edge. Following the edge grinding, the wafer is transferred to the lapping station. A diamond lapping disk, mounted onto a high-precision head, rotates and works to grind down the wafer surface, producing a smooth, flat surface. The disk can be adjusted to rotate in a variety of directions, providing a versatile range of grinding motions that can create different surface finishes. Finally, the wafer is sent to the polishing station where it is polished using a diamond impregnated disc, which works to remove any residual material and produce a mirror-like surface finish. This polishing step ensures that the wafer is ready for assembly into its finished product. P Matic 16 is designed to provide a fast and efficient way to grind, lap and polish wafers without compromising on accuracy. Its easy-to-use touch screen programming and adjustable parameters allow for complete automation of the process, allowing for fast, consistent and efficient processing.