Used SATISLOH PR-150 #293610073 for sale

SATISLOH PR-150 is a wafer grinding, lapping and polishing equipment used for advanced wafer processing. This system is based around Computer Integrated Manufacturing (CIM) principles and offers a highly automated, turnkey solution to grinding the edges and surfaces of wafers. PR-150 unit is a single-table machine specifically designed for production and high-volume processing of large or small-sized wafers. The tool features a heavy-duty, linear motor driven table with a corresponding linear rail. The table is mounted with a precision X-Y-Z robot, which allows for the accurate positioning of wafers for grinding, lapping and polishing. The X-Y-Z robot utilizes a unique 6-axis asset that enables users to move the wafer in a 3D plane, allowing for high accuracy and control. SATISLOH PR-150 model is further equipped with a pneumatic cylinder, an adjustable grinding force and vacuum equipment and a power supply. PR-150 system also incorporates a computer controlled grinding and polishing spindle, which is capable of rotating and regulating the abrasive material or diamond paste to achieve the desired wafer finish. Abrasive materials and diamond paste can be used in the unit, allowing users to tailor their process to their specific requirements. Additionally, the machine includes a special Data Acquisition & Control Tool that enables users to monitor, log and control the asset's parameters and process data. SATISLOH PR-150 model is made of high quality components and is completely compatible with a range of CIM technologies. It is also engineered for excellent efficiency and maneuverability, in order to maximize throughput and minimize downtime. Furthermore, it is easy to install and use, with a reliable and ergonomic design. Overall, PR-150 is an ideal solution for those looking for an automated and comprehensive wafer grinding, lapping and polishing equipment. This system is well-designed and can provide consistent and accurate results in a short period of time. It is capable of grinding large and small sized wafers and is extremely versatile, making it an ideal solution for any size of production run.